TD62S050AFM 2001-12-05 1 toshiba bipolar digital integrated circuit silicon monolithic TD62S050AFM 1-channel darlington sink-current driver the TD62S050AFM is a 1-channel inverting npn darlington sink-current driver. the driver incorporates output clamp diodes used to clamp the counter electromotive force which is generated when driving an inductive load, and an input resistor which limits base current. the driver is optimal for driving relays and leds. when using the driver, pay attention to the thermal conditions. features ultra-small hson6 package with heat sink on rear high output withstandard voltage: v ce (sus) = 50 v (min) large output current: i out = 500 ma (max) dc current amplification ratio: h fe = 1000 (min) built-in input resistor: r in = 2.7 k ? input signal: high level active built-in output clamp diodes pin connection (top view) basic circuit diagram note 1: diodes shown using dotted lines are parasitic. do not use them. note 2: when using the driver, connect the p-gnd pin to the gnd pin. note 3: when using the driver, connect the p-gnd pin to the heat sink on the rear of the package. weight: 0.017 g (typ.) 2.7 k 7.2 k input p-gnd output gnd 3 k common output nc common 1 2 3 input p-gnd gnd 6 5 4
TD62S050AFM 2001-12-05 2 maximum ratings (ta 25c) characteristics symbol rating unit collector-emitter voltage v ceo 50 v output withstand voltage v ce (sus) 50 v output current i out 500 ma input voltage v in 0.5~30 v clamp diode reverse voltage v r 50 v clamp diode forward current i f 500 ma power dissipation p d (note 4) 0.78 w r th (j-a) (note 4) 160 saturated thermal resistance r th (j-c) (note 5) 25 c/w operating temperature t opr 40~85 c storage temperature t stg 55~150 c note 4: 114.3 76.2 1.6 mm glass epoxy film substrate cu heat dissipation pattern 100 mm 2 note 5: when an infinite heat sink is mounted. recommended operating condition (ta 40~85c) characteristics symbol test condition min typ. max unit output withstand voltage v ceo 0 50 v output current i out ta 60c, t j 105c 220 ma input voltage v in 0 24 v output on v in (on) i out 400 ma, h fe 800 2.8 24 input voltage output off v in (off) 0 0.7 v clamp diode reverse voltage v r 50 v clamp diode forward current i f 350 ma electrical characteristics (ta 25c) characteristics symbol test circuit test condition min typ. max unit output leakage current i cex 1 v ce 50 v, v in open 10 a i out 300 ma, i in 500 a 1.1 1.3 output saturation voltage v ce (sat) 2 i out 200 ma, i in 350 a 1.0 1.2 v dc current amplification ratio h fe 2 v ce 2.0 v, i out 350 ma 1000 input current output on i in (on) 3 v in 2.4 v, i out 350 ma 0.4 0.7 ma output on i out 350 ma 2.6 input voltage output on v in (on) 4 v ce 2 v, h fe 800 i out 200 ma 2.2 v clamp diode leakage current i r 5 v r 50 v 10 a clamp diode forward voltage v f 6 i f 350 ma 1.6 2.0 v turn-on delay t on 0.02 turn-off delay t off 7 v out 50 v, r l 125 , c l 15 pf 1.0 s
TD62S050AFM 2001-12-05 3 test circuit 1. i cex 2. v ce (sat) h fe 3. i in (on) 4. v in (on) 5. i r 6. v f 7. t on , t off note 6: pulse width 50 s, duty cycle 10% output impedance 50 , t r 5 ns, t f 10 ns note 7: c l includes probe and jig capacitance. open v in i in ( on ) i out pulse generator input c l 15 pf (note 7) (note 6) open v out output r l i ce x open v in open v ce open v ce , v ce ( sat ) i in i out 10% 90% 90% 10% 10% 50% t on t off t f t r 5 v 0 v oh v ol output input 90% 50% 50 s caution on application 1. the device does not include protectors such as an overcurrent protector and an overvoltage protector. applying excessive current or voltage may damage the device. thus, design with great care to prevent excessive current or voltage from being applied to the device. the device may also be damaged by short-circuits between outputs and power supply/ground. take care when designing output, v cc and gnd line. 2. be sure to mount the device in the correct orientation. make sure that the positive and negative power supply pins are connected the right way round. otherwise, the absolute maximum current and power dissipation ratings may be exceeded and the device may break down or undergo performance degradation, causing it to catch fire or explode, and resulting in injury. open v in ( on ) v ce i out open i r open v r open i f open v f
TD62S050AFM 2001-12-05 4 package dimensions weight: 0.017 g (typ.)
TD62S050AFM 2001-12-05 5 preliminary land pattern preliminary pcb trace dimension 2.2 0.6 0.6 1.6 1.6 0.7 0.7 0.7 0.25 1.3 unit : mm 5 mm 10 mm
TD62S050AFM 2001-12-05 6 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. the products described in this document are subject to the foreign exchange and foreign trade laws. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eb a restrictions on product use
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